Bonding of ceramics and metal. 2 Thermal stress in bonding.

Electric charge trapping, residual stresses and properties of ceramics after metal/ceramics bonding

Ceramics Bonding Using Solder Glass Frit

Ceramics bonding is becoming an important technology and has found wide applications in different engineering and electronic industries. In this paper, furnace bonding of ceramics using solder glass frit was investigated with emphasis on the effects of surface treatment and bonding conditions on bonding strength. Alumina (Al2O3) sheet and SCHOTT solder glass G017-393 were used as the base and b...

Composite Laser Ceramics by Advanced Bonding Technology

Composites obtained by bonding materials with the same crystal structure and different chemical compositions can create new functions that do not exist in conventional concepts. We have succeeded in bonding polycrystalline YAG and Nd:YAG ceramics without any interstices at the bonding interface, and the bonding state of this composite was at the atomic level, similar to the grain boundary struc...

Interface structure and atomic bonding characteristics in silicon nitride ceramics.

Direct atomic resolution images have been obtained that illustrate how a range of rare-earth atoms bond to the interface between the intergranular phase and the matrix grains in an advanced silicon nitride ceramic. It has been found that each rare-earth atom bonds to the interface at a different location, depending on atom size, electronic configuration, and the presence of oxygen at the interf...

No-pair bonding in coinage metal dimers.

High-level ab initio calculations at the coupled cluster with single and double substitutions and perturbative treatment of triple substitutions, CCSD(T), level of theory have been carried out for the dimers of coinage metal atoms Cu, Ag, and Au in the ground 1Sigma(g)+ state and in the excited 3Sigma(u)+ state. All of the calculations have been carried out with the inclusion of scalar-relativi...